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W29GL128CH9T TR

W29GL128CH9T TR

W29GL128CH9T TR

Winbond Electronics

Memory IC

SOT-23

W29GL128CH9T TR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 56-TFSOP (0.724, 18.40mm Width)
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Memory Size 128Mb 16M x 8 8M x 16
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel
Write Cycle Time - Word, Page 90ns
RoHS Status ROHS3 Compliant
W29GL128CH9T TR Product Details

W29GL128CH9T TR Overview


There is a memory type Non-Volatile for this type of device. There is a Tape & Reel (TR) case available. In the case of 56-TFSOP (0.724, 18.40mm Width), it is embedded within the case. On the chip, there is an 128Mb 16M x 8 8M x 16 memory, which is the size of the chip's memory. This device utilizes a FLASH format memory which is of mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. It is capable of handling a voltage supply of 2.7V~3.6V. As far as the mounting type is concerned, Surface Mount is recommended.

W29GL128CH9T TR Features


Package / Case: 56-TFSOP (0.724, 18.40mm Width)

W29GL128CH9T TR Applications


There are a lot of Winbond Electronics W29GL128CH9T TR Memory applications.

  • telecommunications
  • networking
  • hard disk drive (HDD)
  • embedded logic
  • servers
  • mainframes
  • multimedia computers
  • graphics card
  • main computer memory
  • personal digital assistants

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