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628-037-221-052

628-037-221-052

628-037-221-052

EDAC Inc.

BOARD PHOSPHOR BRONZE

SOT-23

628-037-221-052 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Contact Material PHOSPHOR BRONZE
Mounting Type BOARD
Insulation Material THERMOPLASTIC
Shell Material STEEL
Mounting Option 1 #4-40
Mounting Style STRAIGHT
Mounting Option 2 THREADED
Part Status Active
ECCN Code EAR99
Number of Rows 2
Additional Feature STAMPED CONTACTS
HTS Code 8536.69.40.30
Subcategory D Type Connectors
Contact Finish - Mating AU ON NI
Total Number of Contacts 37
Terminal Pitch 2.7686mm
Shell Finish NICKEL
Reference Standard UL
Reliability COMMERCIAL
Body Length or Diameter 2.73 inch
Number Of PCB Rows 2
PCB Contact Pattern STAGGERED
Operating Temperature (Max) 125°C
Body Breadth 0.494 inch
Contact Gender FEMALE
Operating Temperature (Min) -55°C
Body Depth 0.472 inch
Rated Current (Signal) 5A
Contact Style RND PIN-SKT
Contact Resistance 10mOhm
Insulation Resistance 5000000000Ohm
Mating Contact Pitch 0.109 inch
Body/Shell Style PLUG
Termination Type SOLDER
Dielectric Withstanding Voltage 1000VAC V
PCB Contact Row Spacing 2.8448 mm
Contact Finish Termination TIN/LEAD
Contact Pattern STAGGERED
Insertion Force-Max 2.78 N
Withdrawl Force-Min .278 N
Mating Contact Row Spacing 0.112 inch
Insulator Color BLACK
Plating Thickness FLASH inch
Length - Termination 0.165 inch
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $7.34000 $7.34
500 $7.2666 $3633.3
1000 $7.1932 $7193.2
1500 $7.1198 $10679.7
2000 $7.0464 $14092.8
2500 $6.973 $17432.5
628-037-221-052 Product Details

628-037-221-052 Overview


BOARD is the mounting type.There are also other features, like STAMPED CONTACTS, to name a few.

628-037-221-052 Features



628-037-221-052 Applications


There are a lot of EDAC Inc. 628-037-221-052 D-Sub Connectors applications.

  • Communication
  • Electrical substations
  • Industrial Automation
  • Control panels
  • Datacom
  • Refrigeration control
  • Transportation
  • Telecommunications
  • Automotive Electronics
  • Embedded systems

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