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628-037-321-057

628-037-321-057

628-037-321-057

EDAC Inc.

BOARD PHOSPHOR BRONZE

SOT-23

628-037-321-057 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Contact Material PHOSPHOR BRONZE
Mounting Type BOARD
Insulation Material THERMOPLASTIC
Shell Material STEEL
Mounting Option 1 #4-40
Mounting Style STRAIGHT
Mounting Option 2 THREADED
Part Status Active
ECCN Code EAR99
Number of Rows 2
Additional Feature STAMPED CONTACTS, STANDOFFS
HTS Code 8536.69.40.30
Subcategory D Type Connectors
Contact Finish - Mating AU ON NI
Total Number of Contacts 37
Terminal Pitch 2.7686mm
Shell Finish NICKEL
Reference Standard UL
Reliability COMMERCIAL
Body Length or Diameter 2.73 inch
Number Of PCB Rows 2
PCB Contact Pattern STAGGERED
Operating Temperature (Max) 125°C
Body Breadth 0.494 inch
Contact Gender FEMALE
Operating Temperature (Min) -55°C
Body Depth 0.472 inch
Rated Current (Signal) 5A
Contact Style RND PIN-SKT
Contact Resistance 10mOhm
Insulation Resistance 5000000000Ohm
Mating Contact Pitch 0.109 inch
Body/Shell Style PLUG
Termination Type SOLDER
Dielectric Withstanding Voltage 1000VAC V
PCB Contact Row Spacing 2.8448 mm
Contact Finish Termination TIN/LEAD
Contact Pattern STAGGERED
Insertion Force-Max 2.78 N
Withdrawl Force-Min .278 N
Mating Contact Row Spacing 0.112 inch
Insulator Color BLACK
Plating Thickness 15μin
Length - Termination 0.165 inch
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $6.23000 $6.23
500 $6.1677 $3083.85
1000 $6.1054 $6105.4
1500 $6.0431 $9064.65
2000 $5.9808 $11961.6
2500 $5.9185 $14796.25
628-037-321-057 Product Details

628-037-321-057 Overview


A BOARD mounting type is specified for the device.Furthermore, there are other features such as STAMPED CONTACTS, STANDOFFS, to name a few.

628-037-321-057 Features



628-037-321-057 Applications


There are a lot of EDAC Inc. 628-037-321-057 D-Sub Connectors applications.

  • Telecommunications
  • Data Technology
  • Instrumentation
  • All Electrical Machinery
  • Datacom
  • Industrial Automation
  • Refrigeration control
  • Variable speed/frequency drivers
  • Anywhere power is distributed
  • Embedded systems

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