EPC8009

new-10%

Manufacturer part number:EPC8009

Manufacturer:EPC

Description:GANFET TRANS 65V 2.7A BUMPED DIE

Case Package:SOT-23

Datasheet:EPC8009 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	12 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	Die
Supplier Device Package	Die
Operating Temperature	-40°C~150°C TJ
Packaging	Tape & Reel (TR)
Published	2012
Series	eGaN®
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Max Operating Temperature	150°C
Min Operating Temperature	-40°C
Technology	GaNFET (Gallium Nitride)
FET Type	N-Channel
Rds On (Max) @ Id, Vgs	130mOhm @ 500mA, 5V
Vgs(th) (Max) @ Id	2.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds	52pF @ 32.5V
Current - Continuous Drain (Id) @ 25°C	2.7A Ta
Gate Charge (Qg) (Max) @ Vgs	0.45nC @ 5V
Drain to Source Voltage (Vdss)	65V
Drive Voltage (Max Rds On,Min Rds On)	5V
Vgs (Max)	+6V, -4V
Continuous Drain Current (ID)	2.7A
Input Capacitance	52pF
Rds On Max	130 mΩ
RoHS Status	ROHS3 Compliant