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A3B-12PA-2DSA(51)

A3B-12PA-2DSA(51)

A3B-12PA-2DSA(51)

Hirose Electric Co Ltd

A3B-12PA-2DSA(51) datasheet pdf and Rectangular Connectors - Headers, Male Pins product details from Hirose Electric Co Ltd stock available on our website

SOT-23

A3B-12PA-2DSA(51) Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Brass
Mounting Type Through Hole
Contact Shape Square
Insulation Material Polyamide (PA), Nylon
Operating Temperature -55°C~85°C
Packaging Bulk
Series A3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 12
Number of Rows 2
Voltage - Rated 200VAC
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Current Rating (Amps) 1A
Insulation Height 0.071 1.80mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.079 2.00mm
Insulation Color Black
Row Spacing - Mating 0.079 (2.00mm)
Contact Length - Post 0.102 2.60mm
Shrouding Unshrouded
Contact Finish - Post Tin
Contact Length - Mating 0.138 3.50mm
Overall Contact Length 0.311 7.90mm
Contact Finish Thickness - Mating Flash
Contact Finish Thickness - Post 78.7μin 2.00μm
Stack Height (Mating) 6mm 8.8mm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $0.58000 $0.58
10 $0.54000 $5.4
25 $0.48600 $12.15
50 $0.43200 $21.6
100 $0.41400 $41.4
250 $0.37800 $94.5
500 $0.36000 $180
A3B-12PA-2DSA(51) Product Details

A3B-12PA-2DSA(51) Overview


It comes in a Header package.Through Hole is the mount type.A Bulk case is used for packaging.The product belongs to the A3 Series.Operating temperature is set to -55°C~85°C.

A3B-12PA-2DSA(51) Features


A3 series

A3B-12PA-2DSA(51) Applications


There are a lot of Hirose Electric Co Ltd A3B-12PA-2DSA(51) Rectangular Connectors applications.

  • Transportation
  • Data Technology
  • Medical technology
  • Military Technology
  • Automotive Electronics
  • Datacom
  • Embedded systems
  • Telecommunications
  • Instrumentation
  • Communication

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