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DF37B-10DP-0.4V(51)

  • DF37B-10DP-0.4V(51)
  • DF37B-10DP-0.4V(51)

DF37B-10DP-0.4V(51)

DF37B-10DP-0.4V(51)

Hirose Electric Co Ltd

Header, Outer Shroud ContactsTape & Reel (TR)2 Rows0.016 0.40mmSurface Mount10 PositionsDF37GoldSMD/SMTCOPPER ALLOY

SOT-23

DF37B-10DP-0.4V(51) Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material COPPER ALLOY
Mount Surface Mount
Mounting Type Surface Mount
Packaging Tape & Reel (TR)
Series DF37
JESD-609 Code e3
Feature Solder Retention
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
ECCN Code EAR99
Connector Type Header, Outer Shroud Contacts
Number of Positions 10
Number of Rows 2
HTS Code 8536.69.40.40
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.016 0.40mm
Total Number of Contacts 10
Reach Compliance Code unknown
Contact Finish Gold
Mating Information MULTIPLE MATING PARTS AVAILABLE
Contact Gender MALE
Contact Finish Thickness 2.00μin 0.051μm
Height Above Board 0.030 0.75mm
Stack Height (Mating) 0.98mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $0.45000 $0.45
500 $0.4455 $222.75
1000 $0.441 $441
1500 $0.4365 $654.75
2000 $0.432 $864
2500 $0.4275 $1068.75
DF37B-10DP-0.4V(51) Product Details

DF37B-10DP-0.4V(51) Overview


The product is packaged in Header, Outer Shroud Contacts.It has been determined that a Tape & Reel (TR) case is necessary to package the product.This device is mounted in the Surface Mount position.There is a product in the DF37 Series.This can be ensured when the system is in operation by maintaining Solder Retention.For mounting this component, a Surface Mount socket is required.

DF37B-10DP-0.4V(51) Features


DF37 series
Package / Case: Tape & Reel (TR)
Mounting Type:Surface Mount


DF37B-10DP-0.4V(51) Applications


There are a lot of Hirose Electric Co Ltd
DF37B-10DP-0.4V(51) Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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