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DF37B-24DP-0.4V(53)

DF37B-24DP-0.4V(53)

DF37B-24DP-0.4V(53)

Hirose Electric Co Ltd

Header, Outer Shroud Contacts Tape & Reel (TR) 2 Rows 0.016 0.40mm Surface Mount 24 Positions DF37 Gold SMD/SMT Bronze

SOT-23

DF37B-24DP-0.4V(53) Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Bronze
Mount Surface Mount
Mounting Type Surface Mount
Housing Material Polymer
Packaging Tape & Reel (TR)
Series DF37
Feature Solder Retention
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
ECCN Code EAR99
Connector Type Header, Outer Shroud Contacts
Number of Positions 24
Max Operating Temperature 85°C
Min Operating Temperature -35°C
Number of Rows 2
Voltage - Rated 30V
HTS Code 8536.69.40.40
Pitch 0.016 0.40mm
Reach Compliance Code unknown
Current Rating 300mA
Contact Finish Gold
Insulation Resistance 50MOhm
Contact Finish Thickness 2.00μin 0.051μm
Height Above Board 0.030 0.75mm
Stack Height (Mating) 0.98mm
Stack Height 980μm
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1.057930 $1.05793
10 $0.998048 $9.98048
100 $0.941554 $94.1554
500 $0.888259 $444.1295
1000 $0.837980 $837.98
DF37B-24DP-0.4V(53) Product Details

DF37B-24DP-0.4V(53) Overview


The packaging contains Header, Outer Shroud Contacts.This product is packaged in a case marked Tape & Reel (TR).There is a Surface Mount mounting type for the device.Product number DF37 belongs to the DF37 Series.Operating the device, it is possible to maintain Solder Retention.This part must be mounted in a Surface Mount socket.Whenever the temperature is below 85°C, it's best.There is a minimum temperature requirement of [0°C] for this device.

DF37B-24DP-0.4V(53) Features


DF37 series
Package / Case: Tape & Reel (TR)
Mounting Type:Surface Mount
Max Operating temperature at -35°C


DF37B-24DP-0.4V(53) Applications


There are a lot of Hirose Electric Co Ltd
DF37B-24DP-0.4V(53) Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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