BSS670S2LH6327XTSA1 Description
Existing layout geometries used in power applications, PCB assembly equipment, and vapor phase, infrared, or convection soldering processes are all compatible with the DirectFET package. This product is designed for general use and can be used to a variety of settings. These devices are designed to ensure a high level of dv/dt capability for the most demanding applications, in addition to a significant reduction in on-resistance.
BSS670S2LH6327XTSA1 Features
? N-channel enhancement mode
? AEC accreditation
? MSL1 reflow to 260°C maximum
? 175°C operating temperature
? An environmentally friendly product (RoHS compliant)
? To the nth degree, avalanche-proofed
BSS670S2LH6327XTSA1 Applications
Switching applications
