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BTS410F2E3062ANTMA1

BTS410F2E3062ANTMA1

BTS410F2E3062ANTMA1

Infineon Technologies

Tape and Reel Hot Swap Controllers SMD/SMT

SOT-23

BTS410F2E3062ANTMA1 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SMD/SMT
Number of Pins 5
Packaging Tape and Reel
Pbfree Code no
Number of Terminations 4
ECCN Code EAR99
Max Operating Temperature 150°C
Min Operating Temperature -40°C
Terminal Position SINGLE
Terminal Form GULL WING
Number of Functions 1
Supply Voltage 12V
Pin Count 3
JESD-30 Code R-PSSO-G4
Number of Outputs 1
Supply Voltage-Max (Vsup) 42V
Supply Voltage-Min (Vsup) 4.7V
Power Dissipation-Max 50W
Nominal Supply Current 1mA
Power Dissipation 50W
Current - Output 1.6A
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Output Peak Current Limit-Nom 1.8A
Built-in Protections TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Output Current Flow Direction SINK
Length 9.9mm
Width 9.2mm
Radiation Hardening No
RoHS Status RoHS Compliant
BTS410F2E3062ANTMA1 Product Details

BTS410F2E3062ANTMA1 Overview


You get it with the SMD/SMT package.Hot-swappable device comes in the shape of a Tape and Reel.Hot-swappable device terminates wHot-swappable deviceh 4 in total.Device SINGLE is in the terminal position.Total number of pins is 3.High efficiency can be achieved with a voltage supply of 12V.Operating the device requires 5 pins.There is a Surface Mount-axis orientation to it.Stable operation can be achieved with a maximum operating temperature of 150°C°C.Hot-swappable device operates at a minimum temperature of -40°C degrees Celsius in order to ensure reliabilHot-swappable devicey.To ensure normal operation, the supply voltage (Vsup) must be kept above 4.7V.42V is set for Vsup (maximum supply voltage).Hot Swap is defaulted to output 1.

BTS410F2E3062ANTMA1 Features


The terminal position of 3


BTS410F2E3062ANTMA1 Applications


There are a lot of Infineon Technologies
BTS410F2E3062ANTMA1 hot swap controllers applications.


  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads
  • Distributed power systems

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