FF450R33T3E3P3BPMA1 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available on our website
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FF450R33T3E3P3BPMA1 Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
26 Weeks
Mounting Type
Chassis Mount
Package / Case
Module
Operating Temperature
-40°C~150°C
Series
XHP™3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Configuration
Half Bridge
Power - Max
1000000W
Input
Standard
Current - Collector Cutoff (Max)
5mA
Voltage - Collector Emitter Breakdown (Max)
3300V
Current - Collector (Ic) (Max)
450A
Vce(on) (Max) @ Vge, Ic
2.75V @ 15V, 450A
IGBT Type
Trench Field Stop
NTC Thermistor
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
FF450R33T3E3P3BPMA1 Product Details
FF450R33T3E3P3BPMA1 Description
FF450R33T3E3P3BPMA1 is a type of XHP?3 module with Trench/Fieldstop IGBT3 and emitter controlled 3 diode. It is packaged by IGBT (insulated gate bipolar transistor chip) and FWD (freewheeling diode chip) through a specific circuit bridge; the packaged IGBT module is directly used in frequency converters, UPS uninterrupted power supply, and other equipment. It is characterized by energy saving, convenient installation and maintenance, and stable heat dissipation.