FS3L25R12W2H3B11BPSA1 Description

FS3L25R12W2H3B11BPSA1, a product marketed by Utmel Electronics and made by Infineon. It falls within the category of electronic components, ICs.

It is used in a variety of industries, including industrial, aerospace and defense, enterprise systems, personal electronics, and tablet computers. The EasyPACKTM 2B 1200 V, 25 A 3-level full-bridge IGBT module with active "Neutral Point Clamp 2" topology, NTC, High Speed IGBT H3 and PressFIT Contact Technology, AG-EASY2B-2, RoHS are the major specifications of this component. It is also environmentally friendly and RoHS compliant (lead free).

FS3L25R12W2H3B11BPSA1 Features

• High Speed IGBT H3

• Low switching losses

• PressFIT Contact Technology

• Fast Si clamping diodes 25 A 650 V

• Al2O3 substrate with low thermal resistance

• Rugged mounting due to integrated mounting clamps

FS3L25R12W2H3B11BPSA1 Applications

• Solutions for photovoltaic energy systems