IRF6616TR1PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRF6616TR1PBF Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MX
Number of Pins
5
Supplier Device Package
DIRECTFET™ MX
Operating Temperature
-40°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2007
Series
HEXFET®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
SMD/SMT
Resistance
5MOhm
Max Operating Temperature
150°C
Min Operating Temperature
-40°C
Technology
MOSFET (Metal Oxide)
Number of Elements
1
Power Dissipation-Max
2.8W Ta 89W Tc
Power Dissipation
2.8W
Turn On Delay Time
15 ns
FET Type
N-Channel
Rds On (Max) @ Id, Vgs
5mOhm @ 19A, 10V
Vgs(th) (Max) @ Id
2.25V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
3765pF @ 20V
Current - Continuous Drain (Id) @ 25°C
19A Ta 106A Tc
Gate Charge (Qg) (Max) @ Vgs
44nC @ 4.5V
Rise Time
19ns
Drain to Source Voltage (Vdss)
40V
Drive Voltage (Max Rds On,Min Rds On)
4.5V 10V
Vgs (Max)
±20V
Fall Time (Typ)
4.4 ns
Turn-Off Delay Time
21 ns
Continuous Drain Current (ID)
15A
Threshold Voltage
1.8V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
40V
Dual Supply Voltage
40V
Input Capacitance
3.765nF
Recovery Time
23 ns
Drain to Source Resistance
6.2mOhm
Rds On Max
5 mΩ
Nominal Vgs
1.8 V
Height
508μm
Length
6.35mm
Width
5.05mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
RoHS Compliant
Lead Free
Lead Free
IRF6616TR1PBF Product Details
IRF6616TR1PBF Description
IRF6616TR1PBF is a kind of HEXFET? power MOSFET integrating the latest Silicon technology with the advanced DirectFETTM packaging. It is able to provide low resistance and low charge, and ultra-low package inductance for reduced conduction and switching losses. Power MOSFET IRF6616TR1PBF is optimized for high-efficiency DC-DC converters, synchronous rectification, and high-frequency switching.