IRF6645 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
IRF6645 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric SJ
Surface Mount
YES
Transistor Element Material
SILICON
Operating Temperature
-40°C~150°C TJ
Packaging
Tube
Published
2005
Series
HEXFET®
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
3
ECCN Code
EAR99
Terminal Finish
TIN LEAD
Technology
MOSFET (Metal Oxide)
Terminal Position
BOTTOM
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-XBCC-N3
Qualification Status
Not Qualified
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
3W Ta 42W Tc
Operating Mode
ENHANCEMENT MODE
Case Connection
DRAIN
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
35m Ω @ 5.7A, 10V
Vgs(th) (Max) @ Id
4.9V @ 50μA
Input Capacitance (Ciss) (Max) @ Vds
890pF @ 25V
Current - Continuous Drain (Id) @ 25°C
5.7A Ta 25A Tc
Gate Charge (Qg) (Max) @ Vgs
20nC @ 10V
Drain to Source Voltage (Vdss)
100V
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
Drain Current-Max (Abs) (ID)
5.7A
Drain-source On Resistance-Max
0.035Ohm
Pulsed Drain Current-Max (IDM)
45A
DS Breakdown Voltage-Min
100V
Avalanche Energy Rating (Eas)
29 mJ
RoHS Status
Non-RoHS Compliant
IRF6645 Product Details
IRF6645 Description
IRF6645 is a type of DirectFET? power MOSFET developed by Infineon Technologies utilizing its latest Silicon technology and the advanced DirectFET? packaging to provide extremely low on-state resistance in a package with a MICRO-8 footprint. High efficiency and low temperature can be realized based on reduced total losses and excellent thermal performance, thus improving system reliability. As a result, it is well suited for high-performance isolated DC-DC converters.