IRF6718L2TR1PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
IRF6718L2TR1PBF Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric L6
Number of Pins
13
Supplier Device Package
DIRECTFET L6
Operating Temperature
-55°C~175°C TJ
Packaging
Tape & Reel (TR)
Published
2011
Series
HEXFET®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
SMD/SMT
Resistance
500kOhm
Max Operating Temperature
175°C
Min Operating Temperature
-55°C
Technology
MOSFET (Metal Oxide)
Power Dissipation-Max
4.3W Ta 83W Tc
Element Configuration
Single
Power Dissipation
4.3W
Turn On Delay Time
67 ns
FET Type
N-Channel
Rds On (Max) @ Id, Vgs
0.7mOhm @ 61A, 10V
Vgs(th) (Max) @ Id
2.35V @ 150μA
Input Capacitance (Ciss) (Max) @ Vds
6500pF @ 13V
Current - Continuous Drain (Id) @ 25°C
61A Ta 270A Tc
Gate Charge (Qg) (Max) @ Vgs
96nC @ 4.5V
Rise Time
140ns
Drain to Source Voltage (Vdss)
25V
Drive Voltage (Max Rds On,Min Rds On)
4.5V 10V
Vgs (Max)
±20V
Fall Time (Typ)
53 ns
Turn-Off Delay Time
47 ns
Continuous Drain Current (ID)
61A
Threshold Voltage
1.9V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
25V
Dual Supply Voltage
25V
Input Capacitance
6.5nF
Recovery Time
59 ns
Drain to Source Resistance
700μOhm
Rds On Max
700 μΩ
Nominal Vgs
1.9 V
Height
508μm
Length
9.144mm
Width
7.1mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
RoHS Compliant
Lead Free
Lead Free
IRF6718L2TR1PBF Product Details
IRF6718L2TR1PBF Description
The IRF6718L2TRPbF combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFET? packaging to achieve the lowest on-state resistance in a package that has the footprint of a D-peak. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment, vapor phase, and infra-red or convection soldering techniques when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual-sided cooling to maximize thermal transfer in power systems.