IRF7769L2TR1PBF Description

In order to achieve the lowest on-state resistance in a package with a footprint smaller than a D2PAK and only a 0.7 mm profile, the IRF7769L2TR/TR1PbF blends the most recent HEXFET? Power MOSFET Silicon technology with the most modern DirectFETTM packaging. When application note AN-1035 detailing the manufacturing processes and procedures is adhered to, the DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment, and vapor phase, infra-red, or convection soldering techniques. Dual-sided cooling is possible with the DirectFET package, which maximizes heat transmission in power systems. Applications requiring synchronous rectification and high frequency switching are best served by the IRF7769L2TR/TR1PbF. Low temperatures are made possible by the device's reduced overall losses and high level of thermal performance.

IRF7769L2TR1PBF Features

• RoHS Compliant, Halogen Free

• Lead-Free (Qualified up to 260??C Reflow)

• Ideal for High Performance Isolated Converter   

• Primary Switch Socket

• Optimized for Synchronous Rectification

• Low Conduction Losses

• High Cdv/dt Immunity

• Low Profile (<0.7mm)

• Dual Sided Cooling Compatible 

• Compatible with existing Surface Mount Techniques 

• Industrial Qualified

IRF7769L2TR1PBF Applications

• Power Management

• Consumer Electronics

• Portable Devices

• Industrial