IRFR5305TRPBF Description
The fifth generation HEXFET of International Rectifier Company adopts advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with extremely efficient and reliable devices for use in a variety of applications. D-Pak is designed for surface mounting using gas phase, infrared or wave soldering techniques. The direct guide version (IRFU series) is suitable for through-hole installation applications. In a typical surface mount application, the power consumption can be up to 1.5 watts.
IRFR5305TRPBF Features
Ultra Low On-Resistance
Surface Mount (IRFR5305)
Straight Lead (IRFU5305)
Advanced Process Technology
Fast Switching
Fully Avalanche Rated
Lead-Free
IRFR5305TRPBF Applications
through-hole installation applications