IRFS4310ZTRLPBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRFS4310ZTRLPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tape & Reel (TR)
Published
2004
Series
HEXFET®
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Subcategory
FET General Purpose Power
Technology
MOSFET (Metal Oxide)
Terminal Position
SINGLE
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
[email protected] Reflow Temperature-Max (s)
30
JESD-30 Code
R-PSSO-G2
Qualification Status
Not Qualified
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
250W Tc
Operating Mode
ENHANCEMENT MODE
Power Dissipation
250W
Case Connection
DRAIN
Turn On Delay Time
20 ns
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
6m Ω @ 75A, 10V
Vgs(th) (Max) @ Id
4V @ 150μA
Input Capacitance (Ciss) (Max) @ Vds
6860pF @ 50V
Current - Continuous Drain (Id) @ 25°C
120A Tc
Gate Charge (Qg) (Max) @ Vgs
170nC @ 10V
Rise Time
60ns
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
Fall Time (Typ)
57 ns
Turn-Off Delay Time
55 ns
Continuous Drain Current (ID)
120A
Gate to Source Voltage (Vgs)
20V
Drain-source On Resistance-Max
0.006Ohm
Drain to Source Breakdown Voltage
100V
Pulsed Drain Current-Max (IDM)
560A
Nominal Vgs
4 V
Height
4.826mm
Length
10.668mm
Width
9.65mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
800
$1.84700
$1477.6
1,600
$1.73658
$1.73658
2,400
$1.65928
$3.31856
5,600
$1.60407
$8.02035
IRFS4310ZTRLPBF Product Details
IRFS4310ZTRLPBF Description
The IRFS4310ZTRLPBF is a HEXFET? Power MOSFET. The HEXFET? is a voltage-controlled power MOSFET device, which is fundamentally different. To create a flow of current in the drain, a voltage must be provided between the gate and source terminals. A layer of silicon dioxide serves as an electrical barrier between the gate and the source.
IRFS4310ZTRLPBF Features
● Ruggedness of the Gate, Avalanche, and Dynamic dV/dt
● Avalanche SOA and fully characterized capacitance
● Enhanced dV/dt and dI/dt capability of body diodes
● Lead-Free
● Very low RDS(ON) at 4.5Vgs
● Optimized for logic level drive
● Superior R*Q at 4.5Vgs
IRFS4310ZTRLPBF Applications
● Synchronous Rectification with High Efficiency in SMPS
● Power Supply Uninterruptible
● Power Switching at High Speed
● Circuits with hard switches and high frequencies