IRLR3705Z datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
IRLR3705Z Datasheet PDF
non-compliant
Technical Specifications
Parameter Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Surface Mount
YES
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tube
Published
2004
Series
HEXFET®
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Terminal Finish
TIN LEAD
Additional Feature
LOGIC LEVEL COMPATIBLE
HTS Code
8541.29.00.95
Technology
MOSFET (Metal Oxide)
Terminal Position
SINGLE
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
245
[email protected] Reflow Temperature-Max (s)
30
JESD-30 Code
R-PSSO-G2
Qualification Status
Not Qualified
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
130W Tc
Operating Mode
ENHANCEMENT MODE
Case Connection
DRAIN
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
8m Ω @ 42A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
2900pF @ 25V
Current - Continuous Drain (Id) @ 25°C
42A Tc
Gate Charge (Qg) (Max) @ Vgs
66nC @ 5V
Drain to Source Voltage (Vdss)
55V
Drive Voltage (Max Rds On,Min Rds On)
4.5V 10V
Vgs (Max)
±16V
JEDEC-95 Code
TO-252AA
Drain Current-Max (Abs) (ID)
42A
Drain-source On Resistance-Max
0.008Ohm
Pulsed Drain Current-Max (IDM)
360A
DS Breakdown Voltage-Min
55V
Avalanche Energy Rating (Eas)
110 mJ
RoHS Status
Non-RoHS Compliant
In-Stock:1304 items
Pricing & Ordering
Quantity
Unit Price
Ext. Price
300
$2.26153
$678.459
IRLR3705Z Product Details
IRLR3705Z Description
The SO-8 has been modified with custom lead frames to enhance thermal characteristics and dual-chip capabilities, making it ideal for a variety of power applications. With these improvements, multiple devices can be used in one application, greatly reducing circuit board space. The package is designed for gas phase, infrared or wave soldering technology. In typical PCB placement applications, it is possible to consume more than 0.8W.
IRLR3705Z Features
?Adavanced Process Technology ?Ultra Low On-Resistance ?Dual N-ChannelMOSFET Surface Mount ?Available in Tape &Reel ?Dynamic dv/dt Rating ?Fast Switching ?Lead-Free
IRLR3705Z applications
PCB placement applications power applications
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