PEF 20471 E V1.3 Overview

A 217-BGA package is used to reduce board space requirements.In order to pack telecommunications equipment, Tray is used.A Surface Mount mounting type is used.Telecom circuit is made up of 1 circuits.Telecom circuit is possible to increase efficiency by providing 3.13V~3.47V with a higher voltage.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.Telecom switching's base part number of PEF20471 can be used to find more related parts.An electric current of 200mA is supplied to telecom equipment .With the SWITI series electronic parts, it can provide a lot of similar features.

PEF 20471 E V1.3 Features

Available in the 217-BGA package

PEF 20471 E V1.3 Applications

There are a lot of Infineon Technologies PEF 20471 E V1.3 Telecom applications.

• T1/E1/J1 Multiplexer and Channel Banks
• DECT (Digital European Cordless Telephone) Base
• T1 Digital Cross Connects (DSX-1)
• Short/Medium Loop
• Inverse Multiplexing for ATM (IMA)
• Cable modem
• CSU/DSU Equipment
• Stations
• PBX interfaces
• Router