SI3443DV datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
SI3443DV Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
SOT-23-6 Thin, TSOT-23-6
Surface Mount
YES
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tube
Published
2003
Series
HEXFET®
JESD-609 Code
e3
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Additional Feature
ULTRA LOW ON-RESISTANCE
Subcategory
Other Transistors
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
[email protected] Reflow Temperature-Max (s)
30
JESD-30 Code
R-PDSO-G6
Qualification Status
Not Qualified
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
2W Ta
Operating Mode
ENHANCEMENT MODE
FET Type
P-Channel
Rds On (Max) @ Id, Vgs
65m Ω @ 4.4A, 4.5V
Vgs(th) (Max) @ Id
1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
1079pF @ 10V
Current - Continuous Drain (Id) @ 25°C
4.4A Ta
Gate Charge (Qg) (Max) @ Vgs
15nC @ 4.5V
Drain to Source Voltage (Vdss)
20V
Drive Voltage (Max Rds On,Min Rds On)
2.5V 4.5V
Vgs (Max)
±12V
JEDEC-95 Code
MO-193AA
Drain Current-Max (Abs) (ID)
4.4A
Drain-source On Resistance-Max
0.065Ohm
Pulsed Drain Current-Max (IDM)
20A
DS Breakdown Voltage-Min
20V
Avalanche Energy Rating (Eas)
31 mJ
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
3,000
$0.15663
$0.46989
6,000
$0.14714
$0.88284
15,000
$0.13765
$2.06475
30,000
$0.12626
$3.7878
75,000
$0.12151
$9.11325
SI3443DV Product Details
SI3443DV Description
These P-channel MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications.
The TSOP-6 package with its customized leadframe produces a HEXFET power MOSFET with RDS(on) 60% less than a similar size SOT-23. This package is ideal for applications where printed circuit board space is at a premium. It's unique thermal design and RDS(on) reduction enables a current-handling increase of nearly 300% compared to the SOT-23.