70P269L90BYGI Overview

Its memory type can be classified as RAM, SDR, SRAM. The case comes in Bulk size. In the case of TFBGA, it is embedded within the case. A memory chip with a capacity of 32kB is used on this device. As you can see from the diagram, the chip is planted with 100 terminations. It supports up to 1 functions for comprehensive operation. In order to power this memory device, 2.6V will be necessary. A 100-pin package containing this memory device is used to house this device. The memory device in question has 100 pins, thus indicating that it has 100 memory locations that can be accessed. There are 2 ports used in this chip to give read and/or write access to one memory address. I/O port addresses on this device are mapped to memory addresses of COMMON bits. The minimum operating temperature of this device must not be less than -40°C. It should not be operated above 85°C°C. In terms of power consumption, it can operate at a maximum supply of 0.06mA . The SRAMs component is usually regarded as a type of this component. Ideally, this part should be supplied with a voltage of at least 1.8V. In order for it to operate properly, its voltage should not exceed 3V.

70P269L90BYGI Features

Package / Case: TFBGA
100 Pins
I/O Type: COMMON

70P269L90BYGI Applications

There are a lot of Integrated Device Technology (IDT) 70P269L90BYGI Memory applications.

• servers
• mainframes
• personal digital assistants
• hard disk drive (HDD)
• DVD disk buffer
• eDRAM
• cell phones
• multimedia computers
• networking
• telecommunications