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70T3509MS133BP

70T3509MS133BP

70T3509MS133BP

Integrated Device Technology (IDT)

Surface Mount 256 Pin Memory IC 36 Mb kb 17mm mm 1.12A mA 36b b

SOT-23

70T3509MS133BP Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 14 Weeks
Mount Surface Mount
Package / Case BGA
Number of Pins 256
Published 2009
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 256
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 2.6V
Min Supply Voltage 2.4V
Memory Size 4.5MB
Number of Ports 2
Nominal Supply Current 1.12A
Memory Type RAM, SDR, SRAM
Frequency (Max) 133MHz
Access Time 4.2 ns
Organization 1MX36
Output Characteristics 3-STATE
Address Bus Width 40b
Density 36 Mb
Standby Current-Max 0.06A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Length 17mm
Width 17mm
Thickness 1.76mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Contains Lead
Pricing & Ordering
Quantity Unit Price Ext. Price
6 $292.36000 $1754.16
70T3509MS133BP Product Details

70T3509MS133BP Overview


RAM, SDR, SRAM is its memory type. As you can see, it is embedded in BGA case. There is an 4.5MB memory capacity on the chip. As you can see from the diagram, the chip is planted with 256 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 2.5V power supply. It is encased in an 256-pin package that contains this ic memory chip. It has 256 pins indicating it has 256 memory locations. It is noted that the operating supply voltage of this memory is 2.5V. Chips such as this one are mounted using Surface Mount mounting, a straightforward method of mounting that is effective. Memory chip's nominal supply current is 1.12A. While this memory chip features many merits, it also offers FLOW-THROUGH OR PIPELINED ARCHITECTURE for improving system performance. An address can be read and/or written to one memory address using 2 ports on the chip. In addition to this device, there are COMMON-bit memory mapped I/O port addresses on this device. A minimum operating temperature of 0°C must be met by this device. As a general rule, memory ics is recommended that the product be operated at temperatures no higher than 70°Cc, otherwise, damage could be done to it. Generally, this component is considered a type of SRAMs. This memory ics requires a minimum voltage of 2.4V. In order for it to operate properly, its voltage should not exceed 2.6V. In this memory chip, data is processed at a frequency of 133MHz. There is a maximum frequency of 133MHz for this Memory chip.

70T3509MS133BP Features


Package / Case: BGA
256 Pins
Operating Supply Voltage:2.5V
Additional Feature:FLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals


70T3509MS133BP Applications


There are a lot of Integrated Device Technology (IDT)
70T3509MS133BP Memory applications.


  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card
  • hard disk drive (HDD)

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