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71T75602S100BGG8

71T75602S100BGG8

71T75602S100BGG8

Integrated Device Technology (IDT)

Surface Mount 119 Pin Memory IC 18 Mb kb 14mm mm 175mA mA 36b b

SOT-23

71T75602S100BGG8 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mount Surface Mount
Package / Case BGA
Number of Pins 119
Published 2012
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 119
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature PIPELINED ARCHITECTURE
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 2.5V
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 2.625V
Min Supply Voltage 2.375V
Memory Size 2.3MB
Number of Ports 1
Nominal Supply Current 175mA
Memory Type RAM, SDR, SRAM
Frequency (Max) 100MHz
Access Time 5 ns
Output Characteristics 3-STATE
Address Bus Width 19b
Density 18 Mb
Standby Current-Max 0.04A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Standby Voltage-Min 2.38V
Length 14mm
Height Seated (Max) 2.36mm
Width 22mm
Thickness 2.15mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1,000 $21.68775 $21.68775
71T75602S100BGG8 Product Details

71T75602S100BGG8 Overview


RAM, SDR, SRAM is the type of memory it has. The BGA case contains it. The chip has an 2.3MB memory. The chip has 119 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 2.5V of power. The memory device is enclosed in a package with an 119-pin connector. There are 119 pins on this memory device, which indicates it has 119 memory locations in it. A voltage of 2.5V is noted as the operating supply voltage for this memory. In this chip, Surface Mount mounting is used, a straightforward, high-efficiency mounting method. In terms of its nominal supply current, this memory component is rated at 175mA. Despite all its merits, this chip also features PIPELINED ARCHITECTURE to boost system performance. A memory address is accessed through 1 ports on this chip. I/O port addresses on this device are mapped to memory addresses of COMMON bits. This device must operate at a minimum temperature of 0°C. Temperatures no higher than 70°C degrees Celsius are recommended for operation. It is recommended that the minimum supply voltage for this part be no less than 2.375V. Ideally, this part should be supplied with a voltage of at least 2.625V. Data is processed by this memory ics at a frequency of 100MHz. This Memory chip has a maximum frequency of 100MHz.

71T75602S100BGG8 Features


Package / Case: BGA
119 Pins
Operating Supply Voltage:2.5V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 100MHz
100MHz terminals


71T75602S100BGG8 Applications


There are a lot of Integrated Device Technology (IDT)
71T75602S100BGG8 Memory applications.


  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,

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