PUD Series 2-Row Header Solder Copper Alloy Bulk Through Hole, Right Angle Tin Polyamide (PA66), Nylon 6/6, Glass Filled 10-Position Board to Cable/Wire 0.335 8.51mm Height
SOT-23
S10B-PUDSS-1(LF)(SN) Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Contact Material
Copper Alloy
Mount
Through Hole
Mounting Type
Through Hole, Right Angle
Contact Shape
Square
Insulation Material
Polyamide (PA66), Nylon 6/6, Glass Filled
Operating Temperature
-25°C~85°C
Packaging
Bulk
Series
PUD
Published
2011
JESD-609 Code
e3
Feature
Board Guide
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
Solder
Connector Type
Header
Number of Positions
10
Number of Rows
2
Voltage - Rated
250V
Additional Feature
POLARIZED, SIDE ENTRY, SHROUDED
Fastening Type
Latch Holder
Contact Finish - Mating
Tin
MIL Conformance
NO
DIN Conformance
NO
IEC Conformance
NO
Filter Feature
NO
Contact Type
Male Pin
Mixed Contacts
NO
Option
GENERAL PURPOSE
Current Rating (Amps)
3A
Insulation Height
0.335 8.51mm
Style
Board to Cable/Wire
Number of Positions Loaded
All
Pitch - Mating
0.079 2.00mm
Insulation Color
Natural
Row Spacing - Mating
0.079 (2.00mm)
Contact Length - Post
0.118 3.00mm
Shrouding
Shrouded - 4 Wall
UL Flammability Code
94V-0
Material Flammability Rating
UL94 V-0
RoHS Status
RoHS Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.57000
$0.57
10
$0.53400
$5.34
100
$0.40970
$40.97
500
$0.35622
$178.11
S10B-PUDSS-1(LF)(SN) Product Details
S10B-PUDSS-1(LF)(SN) Description
The S10B-PUDSS-1(LF)(SN) is a 2.0mm pitch/Disconnectable Crimp style connector. This board-to-wire connector features a secure locking mechanism and is built with a double-row, 2.0 mm pitch, and crimping method. The stable electric connection is shown to be resistant to conditions like vibration, pinching, and dry circuit despite accomplishing minimal insertion force. Because the tip of the locking mechanism in the receptacle does not extend from its area, the locking can be released even if the header is enclosed by a case wall within the height of the header.