HX318C10FRK2/16

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Manufacturer part number:HX318C10FRK2/16

Manufacturer:Kingston Technology

Description:HX318C10FRK2/16 datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

Case Package:SOT-23

Datasheet:HX318C10FRK2/16 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	EAR99
HTS	8473.30.11.40
Module	DRAM Module
Module Density	16Gbyte
Number of Chip per Module	32
Chip Density (bit)	4G
Data Bus Width (bit)	64
Maximum Clock Rate (MHz)	1866
Chip Configuration	512Mx8
Chip Package Type	FBGA
Minimum Operating Supply Voltage (V)	1.425
Typical Operating Supply Voltage (V)	1.5
Maximum Operating Supply Voltage (V)	1.575
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	85
Module Sides	Double
ECC Support	No
Number of Ranks	Dual
Number of Chip Banks	8
CAS Latency	10
SPD EEPROM Support	No
Standard Package Name	DIM
Supplier Package	DIMM
Mounting	Socket
Package Height	30
Package Length	133.35
PCB changed	240
Lead Shape	No Lead
Part Status	Active
Pin Count	240
Organization	1Gx64x2
PLL	No
Self Refresh	No
Module Type	240DIMM
RoHS Status	Yes with exemptions