M470T5663QZ3-CF700

new-10%

Manufacturer part number:M470T5663QZ3-CF700

Manufacturer:Samsung Electronics

Description:M470T5663QZ3-CF700 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

Case Package:SOT-23

Datasheet:M470T5663QZ3-CF700 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Lead Shape	No Lead
PCB changed	200
Package Width	3.8(Max)
Package Length	67.6
Package Height	30
Mounting	Socket
Supplier Package	USODIMM
Standard Package Name	DIM
SPD EEPROM Support	Yes
CAS Latency	6
Number of Chip Banks	8
Number of Ranks	Dual
ECC Support	No
Module Sides	Double
Supplier Temperature Grade	Commercial
Maximum Operating Temperature (°C)	95
Minimum Operating Temperature (°C)	0
Operating Current (mA)	1360
Maximum Operating Supply Voltage (V)	1.9
Typical Operating Supply Voltage (V)	1.8
Minimum Operating Supply Voltage (V)	1.7
Chip Package Type	FBGA
Chip Configuration	128Mx8
Maximum Clock Rate (MHz)	800
Max. Access Time (ns)	0.4
Data Bus Width (bit)	64
Chip Density (bit)	1G
Number of Chip per Module	16
Module Density	2Gbyte
Module	DRAM Module
HTS	8542.32.00.24
ECCN (US)	4A994.a
Part Status	Obsolete
Pin Count	200
Organization	256Mx64
PLL	No
Self Refresh	Yes
Module Type	200USODIMM
RoHS Status	RoHS Compliant