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HX424S14IB/16

HX424S14IB/16

HX424S14IB/16

Kingston Technology

HX424S14IB/16 datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

SOT-23

HX424S14IB/16 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Socket
Package Height 30
Package Length 69.6
PCB changed 260
Lead Shape No Lead
Supplier Package SODIMM
Standard Package Name DIM
SPD EEPROM Support Yes
CAS Latency 14
Number of Ranks Dual
ECC Support No
Module Sides Double
Maximum Operating Temperature (°C) 85
Minimum Operating Temperature (°C) 0
Typical Operating Supply Voltage (V) 1.2
Chip Package Type FBGA
Chip Configuration 1Gx8
Maximum Clock Rate (MHz) 2400
Data Bus Width (bit) 64
Chip Density (bit) 8G
Number of Chip per Module 16
Module Density 16Gbyte
Module SRAM Module
HTS 8473.30.11.40
ECCN (US) EAR99
Part Status Obsolete
Pin Count 260
Organization 2Gx64
PLL No
Self Refresh Yes
Module Type 260SODIMM
RoHS Status Supplier Unconfirmed

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