M393B1G73EB0-YK0

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Manufacturer part number:M393B1G73EB0-YK0

Manufacturer:Samsung Electronics

Description:M393B1G73EB0-YK0 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

Case Package:SOT-23

Datasheet:M393B1G73EB0-YK0 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	4A994.a
HTS	8473.30.11.40
Module	DRAM Module
Module Density	8Gbyte
Number of Chip per Module	18
Chip Density (bit)	4G
Data Bus Width (bit)	72
Maximum Clock Rate (MHz)	1600
Chip Configuration	512Mx8
Minimum Operating Supply Voltage (V)	1.283/1.425
Typical Operating Supply Voltage (V)	1.35/1.5
Maximum Operating Supply Voltage (V)	1.45/1.575
Operating Current (mA)	1160
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	95
Module Sides	Double
ECC Support	No
Number of Ranks	Dual
Number of Chip Banks	8
CAS Latency	11
SPD EEPROM Support	Yes
Supplier Package	RDIMM
Mounting	Socket
Package Height	30
Package Length	133.35
Package Width	4(Max)
PCB changed	240
Part Status	Active
Pin Count	240
Organization	1Gx72
PLL	No
Self Refresh	Yes
Module Type	240RDIMM
RoHS Status	RoHS Compliant