KSM26RD8/32MEI

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Manufacturer part number:KSM26RD8/32MEI

Manufacturer:Kingston Technology

Description:KSM26RD8/32MEI datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

Case Package:SOT-23

Datasheet:KSM26RD8/32MEI Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
PCB changed	288
Package Length	133.35
Package Height	31.25
Mounting	Socket
Supplier Package	RDIMM
SPD EEPROM Support	No
CAS Latency	19
Number of Ranks	Dual
ECC Support	Yes
Module Sides	Double
Maximum Operating Temperature (°C)	85
Minimum Operating Temperature (°C)	0
Operating Current (mA)	1656
Typical Operating Supply Voltage (V)	1.2
Chip Package Type	FBGA
Chip Configuration	2Gx8
Maximum Clock Rate (MHz)	2666
Data Bus Width (bit)	72
Chip Density (bit)	16G
Number of Chip per Module	18
Module Density	32Gbyte
Module	DRAM Module
HTS	8473.30.11.40
ECCN (US)	4A994.a
Part Status	Active
Pin Count	288
Organization	4Gx72
PLL	No
Self Refresh	Yes
Module Type	288RDIMM
RoHS Status	RoHS Compliant