KSM26RS8/8MEI

new-10%

Manufacturer part number:KSM26RS8/8MEI

Manufacturer:Kingston Technology

Description:KSM26RS8/8MEI datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

Case Package:SOT-23

Datasheet:KSM26RS8/8MEI Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	EAR99
HTS	8473.30.11.40
Module	DRAM Module
Module Density	8Gbyte
Number of Chip per Module	9
Chip Density (bit)	8G
Data Bus Width (bit)	72
Maximum Clock Rate (MHz)	2666
Chip Configuration	1Gx8
Chip Package Type	FBGA
Typical Operating Supply Voltage (V)	1.2
Operating Current (mA)	1404
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	85
ECC Support	Yes
Number of Ranks	Single
CAS Latency	19
Supplier Package	RDIMM
Mounting	Socket
Package Height	31.25
Package Length	133.35
PCB changed	288
Part Status	Obsolete
Pin Count	288
Organization	1Gx72
Module Type	288DIMM
RoHS Status	RoHS Compliant