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KVR13LSE9/8

KVR13LSE9/8

KVR13LSE9/8

Kingston Technology

KVR13LSE9/8 datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

SOT-23

KVR13LSE9/8 Datasheet

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Specifications
Name Value
Type Parameter
ECCN (US) EAR99
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1333
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.28/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support Yes
Number of Ranks Dual
Number of Chip Banks 8
CAS Latency 9
PC Type PC3-10600
SPD EEPROM Support No
Standard Package Name DIMM
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 67.6
PCB changed 204
Lead Shape No Lead
Part Status Obsolete
Pin Count 204
Organization 1Gx72
PLL No
Self Refresh No
Module Type 204SODIMM
RoHS Status Yes with exemptions

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