W3E32M72S-266BM

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Manufacturer part number:W3E32M72S-266BM

Manufacturer:Microsemi

Description:W3E32M72S-266BM datasheet pdf and Memory Cards product details from Microsemi stock available on our website

Case Package:SOT-23

Datasheet:W3E32M72S-266BM Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	4A994.a
Module	DRAM Module
Module Density	256Mbyte
Number of Chip per Module	5
Chip Density (bit)	460.8M
Data Bus Width (bit)	72
Max. Access Time (ns)	0.75
Maximum Clock Rate (MHz)	266
Chip Package Type	PBGA
Minimum Operating Supply Voltage (V)	2.3
Typical Operating Supply Voltage (V)	2.5
Maximum Operating Supply Voltage (V)	2.7
Operating Current (mA)	2000
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	125
Supplier Temperature Grade	Military
ECC Support	Yes
Number of Chip Banks	4
CAS Latency	2.5
SPD EEPROM Support	No
Supplier Package	BGA
Mounting	Surface Mount
Package Height	2.03(Max)
Package Length	32.1(Max)
Package Width	25.1(Max)
PCB changed	219
Pin Count	219
Organization	32Mx72
PLL	No
Self Refresh	Yes
RoHS Status	Supplier Unconfirmed