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67SLG060080070PI00

67SLG060080070PI00

67SLG060080070PI00

Laird Technologies EMI

Film Over Foam 0.236 6.00mm 0.276 7.00mm 0.315 8.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 8.001mm Rectangle -40°C~70°C

SOT-23

67SLG060080070PI00 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 4 Weeks
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape Rectangle
Operating Temperature -40°C~70°C
Packaging Tape & Reel (TR)
Series SMD Grounding Metallized
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Film Over Foam
Max Operating Temperature 158°C
Min Operating Temperature -40°C
Attachment Method Solder
Height 0.315 8.00mm
Length 0.276 7.00mm
Width 0.236 6.00mm
Thickness 8.001mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
650 $0.31625 $205.5625
1,300 $0.24438 $0.24438
3,250 $0.22281 $0.66843
6,500 $0.20844 $1.25064
16,250 $0.19406 $3.10496
32,500 $0.18400 $5.888
67SLG060080070PI00 Product Details

67SLG060080070PI00 Overview


The Contact RFI is packaged with the materials of Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI operates normally at -40°C~70°C. The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.A contacter RFI temperature of 158°C degrees Celsius is recommended.Type Film Over Foam from the contacter RFI.As you may know, this RFI EMI comes from the well-known SMD Grounding Metallized series product line.

67SLG060080070PI00 Features


Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series


67SLG060080070PI00 Applications


There are a lot of Laird Technologies EMI
67SLG060080070PI00 RFI and EMI Contacts applications.


  • Switch
  • LoT applications
  • Power Amplifier
  • Low Noise Amplifier
  • Power management
  • Internet of Things
  • Secure Payment
  • Home and Security
  • Health and Fitness
  • Industrial Logger

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