Film Over Foam 0.236 6.00mm 0.276 7.00mm 0.315 8.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 8.001mm Rectangle -40°C~70°C
SOT-23
67SLG060080070PI00 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
4 Weeks
Material
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape
Rectangle
Operating Temperature
-40°C~70°C
Packaging
Tape & Reel (TR)
Series
SMD Grounding Metallized
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Type
Film Over Foam
Max Operating Temperature
158°C
Min Operating Temperature
-40°C
Attachment Method
Solder
Height
0.315 8.00mm
Length
0.276 7.00mm
Width
0.236 6.00mm
Thickness
8.001mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
650
$0.31625
$205.5625
1,300
$0.24438
$0.24438
3,250
$0.22281
$0.66843
6,500
$0.20844
$1.25064
16,250
$0.19406
$3.10496
32,500
$0.18400
$5.888
67SLG060080070PI00 Product Details
67SLG060080070PI00 Overview
The Contact RFI is packaged with the materials of Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI operates normally at -40°C~70°C. The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.A contacter RFI temperature of 158°C degrees Celsius is recommended.Type Film Over Foam from the contacter RFI.As you may know, this RFI EMI comes from the well-known SMD Grounding Metallized series product line.
67SLG060080070PI00 Features
Film Over Foam Tape & Reel (TR) is used SMD Grounding Metallized series
67SLG060080070PI00 Applications
There are a lot of Laird Technologies EMI 67SLG060080070PI00 RFI and EMI Contacts applications.