67SLH060100050PI00

join

new-10%

Manufacturer part number:67SLH060100050PI00

Manufacturer:Laird Technologies EMI

Description:Film Over Foam 0.236 6.00mm 0.197 5.00mm 0.394 10.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 10.0076mm Hourglass -40°C~70°C

Case Package:SOT-23

Datasheet:67SLH060100050PI00 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Material	Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape	Hourglass
Operating Temperature	-40°C~70°C
Packaging	Tape & Reel (TR)
Series	SMD Grounding Metallized
Published	2015
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Film Over Foam
Max Operating Temperature	158°C
Min Operating Temperature	-40°C
Attachment Method	Solder
Height	0.394 10.00mm
Length	0.197 5.00mm
Width	0.236 6.00mm
Thickness	10.0076mm
RoHS Status	RoHS Compliant

Quantity	Unit Price	Ext. Price
1	$0.740000	$0.74
10	$0.698113	$6.98113
100	$0.658597	$65.8597
500	$0.621318	$310.659
1000	$0.586149	$586.149

67SLH060100050PI00 Overview

Contact RFI is packaged with materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI is capable of operating at the operating temperature of -40°C~70°C.High reliability is achieved by using advanced RFI and EMI contact' packagings Tape & Reel (TR).Contacter RFI should run at a temperature 158°C higher than 158°C.Film Over Foam contacter RFI type.RFI EMIs from the well-known SMD Grounding Metallized series product line are featured in this RFI EMI.