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LCMXO2-640HC-6SG48I

LCMXO2-640HC-6SG48I

LCMXO2-640HC-6SG48I

Lattice Semiconductor Corporation

FPGAs MachXO2 Series 48-VFQFN Exposed Pad

SOT-23

LCMXO2-640HC-6SG48I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 48-VFQFN Exposed Pad
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2013
Series MachXO2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
HTS Code 8542.39.00.01
Voltage - Supply 2.375V~3.465V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 40
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 640
Total RAM Bits 18432
Number of LABs/CLBs 80
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $5.15000 $5.15
25 $4.98960 $124.74
LCMXO2-640HC-6SG48I Product Details

LCMXO2-640HC-6SG48I Overview


In the 48-VFQFN Exposed Pad package, you will find fpga chips. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. This device features 40 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 640 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. A supply voltage of 2.375V~3.465V is needed in order for fpga chips to operate. FPGAs belonging to the MachXO2 series are a type of FPGA that belong to the MachXO2 series of FPGAs. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. As a space-saving measure, this FPGA model is contained within Tray. A device like this one offers 18432 RAM bits, which is a considerable amount of memory. 80 LABs/CLBs are configured on this FPGA.

LCMXO2-640HC-6SG48I Features


40 I/Os
Up to 18432 RAM bits

LCMXO2-640HC-6SG48I Applications


There are a lot of Lattice Semiconductor Corporation LCMXO2-640HC-6SG48I FPGAs applications.

  • Security systems
  • Space Applications
  • Ecosystem
  • Cryptography
  • Automotive advanced driver assistance systems (ADAS)
  • ASIC prototyping
  • Bioinformatics
  • Distributed Monetary Systems
  • Enterprise networking
  • Wired Communications

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