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LCMXO3LF-9400E-6BG256I

LCMXO3LF-9400E-6BG256I

LCMXO3LF-9400E-6BG256I

Lattice Semiconductor Corporation

FPGAs MachXO3 Series 256-LFBGA

SOT-23

LCMXO3LF-9400E-6BG256I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-LFBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series MachXO3
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Voltage - Supply 1.14V~1.26V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 206
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 9400
Total RAM Bits 442368
Number of LABs/CLBs 1175
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $18.43000 $18.43
25 $16.05920 $401.48
100 $14.57430 $1457.43
LCMXO3LF-9400E-6BG256I Product Details

LCMXO3LF-9400E-6BG256I Overview


In the package 256-LFBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Fpga chips is programmed wFpga chipsh 206 I/Os for transferring data in a more coherent manner. To form a fundamental building block, there are 9400 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. As part of the MachXO3 series of FPGAs, it is a type of FPGA. The operating temperature should be kept at -40°C~100°C TJ when operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 442368 bFpga chipss. 1175 LABs and CLBs are built into this FPGA.

LCMXO3LF-9400E-6BG256I Features


206 I/Os
Up to 442368 RAM bits

LCMXO3LF-9400E-6BG256I Applications


There are a lot of Lattice Semiconductor Corporation LCMXO3LF-9400E-6BG256I FPGAs applications.

  • Medical ultrasounds
  • Industrial Ethernet
  • ASIC prototyping
  • Voice recognition
  • Audio
  • Solar Energy
  • Embedded Vision
  • OpenCL
  • Industrial,Medical and Scientific Instruments
  • Data Center

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