Welcome to Hotenda.com Online Store!

logo
userjoin
Home

LFXP10C-3FN256C

LFXP10C-3FN256C

LFXP10C-3FN256C

Lattice Semiconductor Corporation

1.8V V 2.1mm mm 31.9kB B FPGAs XP Series 320MHz MHz 256-BGA 1mm mm 256

SOT-23

LFXP10C-3FN256C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2007
Series XP
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.8V
Terminal Pitch 1mm
Frequency 320MHz
[email protected] Reflow Temperature-Max (s) 40
Base Part Number LFXP10
Pin Count 256
Number of Outputs 188
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Power Supplies 1.8/2.5/3.3V
Memory Size 31.9kB
Number of I/O 188
RAM Size 27kB
Organization 1216 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 10000
Total RAM Bits 221184
Number of Logic Blocks (LABs) 1250
Combinatorial Delay of a CLB-Max 0.63 ns
Number of CLBs 1216
Number of Logic Cells 1216
Height Seated (Max) 2.1mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $120.00000 $120
500 $118.8 $59400
1000 $117.6 $117600
1500 $116.4 $174600
2000 $115.2 $230400
2500 $114 $285000
LFXP10C-3FN256C Product Details

LFXP10C-3FN256C Overview


In the package 256-BGA, this product is provided. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Fpga chips is programmed wFpga chipsh 188 I/Os for transferring data in a more coherent manner. In order to construct a fundamental building block, 10000 logic elements/cells are required. It is powered from a supply voltage of 1.8V. There is a Field Programmable Gate Arrays family component in this FPGA part. With a Surface Mount connector, this FPGA module can be attached to the development board. A supply voltage of 1.71V~3.465V is needed in order for fpga chips to operate. The FPGA belongs to the XP series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In this device, 188 outputs are incorporated in order to provide you with maximum flexibility. As a space-saving measure, this FPGA model is contained within Tray. In total, the terminations of this piece are 256. This device is equipped with 221184 RAM bits in terms of its RAM si221184e. For related parts, use its base part number LFXP10. The RAM si27kBe of this FPGA module reaches 27kB so as to guarantee the normal operation of the program during operation. The device has 256 pins which are included in the design. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. There is a 1.8/2.5/3.3V power supply that is required to operate it. In addition to this, it has 256 pins. There are 1250 logic blocks (LABs) in the system, which form its basic building blocks. Programs and data can be stored in the 31.9kB memory embedded in this FPGA module. A CLB is a basic module that determines the architecture of a system. With a frequency of 320MHz, it delivers high efficiency. As most of the logic cells for the building blocks are 1216 logic cells, it incorporates a lot of logic.

LFXP10C-3FN256C Features


188 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
1250 logic blocks (LABs)
Operating from a frequency of 320MHz

LFXP10C-3FN256C Applications


There are a lot of Lattice Semiconductor Corporation LFXP10C-3FN256C FPGAs applications.

  • ASIC prototyping
  • Military DSP
  • Software-defined radios
  • Distributed Monetary Systems
  • Computer hardware emulation
  • Telecommunication
  • Wireless Communications
  • Consumer Electronics
  • Military Temperature
  • Data center hardware accelerators

Related Part Number

Get Subscriber

Enter Your Email Address, Get the Latest News