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LFXP15C-3FN256I

LFXP15C-3FN256I

LFXP15C-3FN256I

Lattice Semiconductor Corporation

1.8V V 2.1mm mm 48.1kB B FPGAs XP Series 256-BGA 1mm mm 256

SOT-23

LFXP15C-3FN256I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2007
Series XP
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.8V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
Base Part Number LFXP15
Pin Count 256
Number of Outputs 188
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Power Supplies 1.8/2.5/3.3V
Memory Size 48.1kB
Number of I/O 188
RAM Size 40.5kB
Organization 1932 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 15000
Total RAM Bits 331776
Number of Gates 4
Max Frequency 320MHz
Number of Logic Blocks (LABs) 1875
Combinatorial Delay of a CLB-Max 0.63 ns
Number of CLBs 1932
Number of Logic Cells 1932
Height Seated (Max) 2.1mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $102.87000 $102.87
500 $101.8413 $50920.65
1000 $100.8126 $100812.6
1500 $99.7839 $149675.85
2000 $98.7552 $197510.4
2500 $97.7265 $244316.25
LFXP15C-3FN256I Product Details

LFXP15C-3FN256I Overview


A 256-BGA package contains it, and it is available for download. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Having 188 I/Os makes data transfers more coherent. A fundamental building block is made up of 15000 logic elements/cells. 1.8V volts power it. The Field Programmable Gate Arrays family of FPGAs includes this part. Using a Surface Mount connector, you can mount this FPGA module on the development board. With a supply voltage of 1.71V~3.465V, this device operates with ease. The XP series FPGA is a type of FPGA that belongs to the XP family of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. A device such as this one has 188 outputs built into it. It is for space saving reasons that this FPGA model is contained in Tray. In total, it has a total of 256 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 331776 bFpga chipss. For related parts, use its base part number LFXP15. Fpga electronics is important that this FPGA module has a RAM si40.5kBe of 40.5kB in order to ensure that the program will run normally. This cable has 256 pins and is designed to connect to a computer. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Its flexibility is fully utilized when operated with a supply voltage of 1.8V. There is a 1.8/2.5/3.3V power supply that is required to operate it. Fpga semiconductor is made up of 4 gates as fpga semiconductors basic building block. I am going to present you with a device that is equipped with 256 pins. 1875 logic blocks (LABs) constitute its basic building block. In this FPGA module, there is a memory of 48.1kB available for storing applications and data. There are 1932 CLBs that make up the architecture of the system. In fact, this FPGA is capable of reaching a speed of 320MHz. For the building block, it incorporates 1932 logic cells that are used to make it work.

LFXP15C-3FN256I Features


188 I/Os
Up to 331776 RAM bits
256 LABs/CLBs
1875 logic blocks (LABs)

LFXP15C-3FN256I Applications


There are a lot of Lattice Semiconductor Corporation LFXP15C-3FN256I FPGAs applications.

  • Audio
  • Military Temperature
  • Telecommunication
  • Solar Energy
  • Data center search engines
  • Cryptography
  • Voice recognition
  • Distributed Monetary Systems
  • Industrial IoT
  • Automotive

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