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DS3070W-100#

DS3070W-100#

DS3070W-100#

Maxim Integrated

256 Pin Memory IC DS3070W 27mm mm

SOT-23

DS3070W-100# Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Number of Pins 256
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2006
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 256
ECCN Code 3A991.B.2.A
Terminal Finish TIN SILVER COPPER
HTS Code 8542.32.00.41
Technology NVSRAM (Non-Volatile SRAM)
Voltage - Supply 3V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 245
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Frequency 100GHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number DS3070W
Pin Count 256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Memory Size 16Mb 2M x 8
Memory Type Non-Volatile
Operating Mode SYNCHRONOUS
Memory Format NVSRAM
Memory Interface Parallel
Organization 2MX8
Memory Width 8
Write Cycle Time - Word, Page 100ns
Memory Density 16777216 bit
Access Time (Max) 100 ns
Length 27mm
Height Seated (Max) 8.72mm
Width 27mm
RoHS Status ROHS3 Compliant
DS3070W-100# Product Details

DS3070W-100# Overview


Non-Volatile is the type of memory it has. There is a Tray case available. The 256-BGA case contains it. The chip has an 16Mb 2M x 8 memory. This device uses a NVSRAM-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 3V~3.6V can be supplied to memory ics. Its recommended mounting type is Surface Mount. The chip has 256 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 3.3V of power. Similar parts are frequently selected using DS3070W, the device's base part number. The memory device is enclosed in a package with an 256-pin connector. There are 256 pins on this memory device, which indicates it has 256 memory locations in it. Data is processed by this memory ics at a frequency of 100GHz.

DS3070W-100# Features


Package / Case: 256-BGA
256 Pins
Freguency at 100GHz
100GHz terminals


DS3070W-100# Applications


There are a lot of Maxim Integrated
DS3070W-100# Memory applications.


  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,

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