MAX13223EEUP+ Overview

Due to the enhanced 20-TSSOP (0.173, 4.40mm Width) package, this driver IC is excellent for driving common LEDs.Tube package is used for this receiver.Being a Transceiver can transceiver, this part has empowered many solutions to serve for a variety of applications.Ideally, you should place this wide receiver on a Surface Mount-type PCB or development board.Power supply requirements for this differential driver are 3V~5.5V.At any one time, this electronic part can have up to 2/2 eligible receivers/drivers.IC receiver's like this are designed for applications requiring a -40°C~85°C operating temperature.Wide receiver can operate within the range of 3.3V supply voltages efficiently.Integrated into this wide receiver are 20 terminations that are used for driving and receiving signals from data.As a standard package, this transceiver comes with a 20-pin layout that follows the market standard.With the part number MAX13223 identifying the product type, temperature, package, etc., you can search with it to see more variants.It is a 20-pin driver IC with enhanced power dissipation controls.Optical transceiver package size is greatly reduced due to downsizing of the ICs and high-density Surface Mount mounting technologies.There are typically 2 bits of resolution specified in the specifications of this receiver.There are two types of input voltage supply available for this IC, 3.3V.There is a subcategory called Line Driver or Receivers for this rf transceiver module.IC3.3/5V is a high performance driver IC designed to work with a 3.3/5V power supply.There are 1 transceivers in total that this module isolated transceiver implements.The part is embedded with 2 drivers, so it can be used with 2 devices.An IC with 8 standard serial I/Os is provided in this package.

MAX13223EEUP+ Features

Tube package
20 pin count
20 pins
3.3/5V power supply

MAX13223EEUP+ Applications

There are a lot of Maxim Integrated MAX13223EEUP+ Drivers/Receivers/Transceivers applications.

• Switching system
• Military satellite communications
• Televisions
• Notebook
• Carrier phase observations
• Wireless smart house
• Metro access rings
• Structural bonding
• Indoor ad hoc meeting
• Ship