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MAX2321EUP+

MAX2321EUP+

MAX2321EUP+

Maxim Integrated

MAX2321EUP+ datasheet pdf and RF Misc ICs and Modules product details from Maxim Integrated stock available on our website

SOT-23

MAX2321EUP+ Datasheet

non-compliant

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Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width) Exposed Pad
Surface Mount YES
Packaging Tube
Published 2006
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
ECCN Code EAR99
Terminal Finish Tin (Sn)
HTS Code 8542.39.00.01
Subcategory RF/Microwave Up/Down Converters
Construction COMPONENT
Frequency 800MHz~1GHz 1.8GHz~2.5GHz
Function Dual Band LNA/Mixer
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Power Supplies 3/3.3V
Supply Current-Max 30.8mA
RF/Microwave Device Type DOWN CONVERTER
RF Type CDMA, GSM, PDC, TDMA, WCDMA
Characteristic Impedance 50Ohm
Secondary Attributes With LO Doubler
LO Tunable YES
Down Conversion Gain-Min 9.6 dB
Noise Figure-Max 13.5 dB
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $5.713400 $5.7134
10 $5.390000 $53.9
100 $5.084906 $508.4906
500 $4.797081 $2398.5405
1000 $4.525548 $4525.548
MAX2321EUP+ Product Details

MAX2321EUP+ Overview


Using the frequency of 800MHz~1GHz 1.8GHz~2.5GHz, RF modulator operates.This RF IC is excellent due to its enhanced 20-TSSOP (0.173, 4.40mm Width) Exposed Pad package.The Tube package houses this RF modulator.This RF modulator can be placed on any Surface Mount-type PCB or development board.20 terminations are integrated into this RF module for driving and receiving signals from data.

MAX2321EUP+ Features


Frequency of 800MHz~1GHz 1.8GHz~2.5GHz
20-TSSOP (0.173, 4.40mm Width) Exposed Pad package
Tube
20 terminations

MAX2321EUP+ Applications


There are a lot of Maxim Integrated MAX2321EUP+ RF Misc ICs and Modules applications.

  • Lock in amplification
  • Fixed wireless access
  • VSAT radios
  • PLL frequency range extender
  • PA linearization
  • Electronic bumper
  • Quadrature detection
  • Demodulation
  • Collision avoidance
  • Cellular Infrastructure

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