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MAX5115EEP+T

MAX5115EEP+T

MAX5115EEP+T

Maxim Integrated

DAC Voltage - Buffered Surface Mount String DAC R 3.9mm mm

SOT-23

MAX5115EEP+T Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 20-SSOP (0.154, 3.90mm Width)
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2007
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
Terminal Finish TIN
Technology BICMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.635mm
Base Part Number MAX5115
Pin Count 20
JESD-30 Code R-PDSO-G20
Output Type Voltage - Buffered
Number of Bits 8
Architecture String DAC
Converter Type D/A CONVERTER
Reference Type External
Data Interface I2C
Differential Output No
Voltage - Supply, Analog 2.7V~5.25V
Voltage - Supply, Digital 2.7V~5.25V
Settling Time 8μs (Typ)
Linearity Error-Max (EL) 0.3906%
Input Bit Code OFFSET BINARY
INL/DNL (LSB) ±2, ±1
Input Format SERIAL
Number of D/A Converters 4
Height Seated (Max) 1.73mm
Width 3.9mm
RoHS Status ROHS3 Compliant
MAX5115EEP+T Product Details

MAX5115EEP+T Overview


In the package 20-SSOP (0.154, 3.90mm Width), this product is provided. Supply voltage is 3V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. It is necessary to keep the operating temperature within -40°C~85°C when the device is operating. As a result of space limitations, this FPGA model has been included in Tape & Reel (TR). In total, the terminations of this piece are 20. MAX5115 is the base part number that can be used to identify related parts. I am going to present you with a device that is equipped with 20 pins.

MAX5115EEP+T Features


20-SSOP (0.154, 3.90mm Width) package
20 pin count


MAX5115EEP+T Applications


There are a lot of Maxim Integrated
MAX5115EEP+T Digital to Analog Converters (DAC) applications.


  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation
  • Automatic Test Equipment
  • Portable Equipment

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