There are two packages that contain it: 24-TSSOP (0.173, 4.40mm Width) package and X package. An attachment Surface Mount allows the FPGA module to be attached to the development board. When operating the machine, it is important to keep the temperature within -40°C~85°C range. There is an FPGA model contained in Tape & Reel (TR) in order to conserve space. In order to find related parts, use the part number MAX5590 as a base.
MAX5590AEUG+T Features
24-TSSOP (0.173, 4.40mm Width) package
MAX5590AEUG+T Applications
There are a lot of Maxim Integrated MAX5590AEUG+T Digital to Analog Converters (DAC) applications.
Digital Potentiometer
Software Radio
Wireless infrastructure:
WCDMA, CDMA2000, TD-SCDMA, WiMAX
Wideband communications:
LMDS/MMDS, point-to-point
Instrumentation:
RF signal generators, arbitrary waveform generators