XRT73R06IB Overview

A 217-BBGA package saves space on a board.A Tray-packing method is used to pack telecommunications equipment.Surface Mount is used as telecommunications equipment mounting type.There are 6 circuits in this telecom IC .The supply voltage of 3.135V~3.465V can increase efficiency.At -40°C~85°C, reliable performance can be achieved.There is a supply current of 725mA for telecom equipment to operate on.

XRT73R06IB Features

Available in the 217-BBGA package

XRT73R06IB Applications

There are a lot of MaxLinear, Inc. XRT73R06IB Telecom applications.

• Remote wireless modules
• Digital Modems
• Digital Access Cross-connect System (DACs)
• Integrated Access Devices (IADs)
• SDH Multiplexers
• Voice over IP/DSL
• T2 Rates PCM Line Interface
• E2 Rates PCM Line Interface
• Frame Relay Switches and Access Devices (FRADS)
• Wireless base stations