XRT73R06IB-F Overview

A 217-BBGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount mounting type is used.An 6-circuit makes up this telecom IC .Providing 3.135V~3.465V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Operating temperatures of -40°C~85°C can ensure reliable performance.A 725mA supply current is required to operate telecom equipment .

XRT73R06IB-F Features

Available in the 217-BBGA package

XRT73R06IB-F Applications

There are a lot of MaxLinear, Inc. XRT73R06IB-F Telecom applications.

• Fiber In The Loop (FITL)
• Hybrid fiber coax (HFC)
• Interfaces to SONET STS-1 Networks
• Wireless Local Loop
• PBX interfaces
• E1 Multiplexer
• Digital Access Cross-connect System (DACs)
• E1 Rates PCM Line Interface
• Digital subscriber line access multiplexer (DSLAM)
• E2 Rates PCM Line Interface