XRT73R06IB-F Overview
A 217-BBGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount mounting type is used.An 6-circuit makes up this telecom IC .Providing 3.135V~3.465V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Operating temperatures of -40°C~85°C can ensure reliable performance.A 725mA supply current is required to operate telecom equipment .
XRT73R06IB-F Features
Available in the 217-BBGA package
XRT73R06IB-F Applications
There are a lot of MaxLinear, Inc. XRT73R06IB-F Telecom applications.
- Fiber In The Loop (FITL)
- Hybrid fiber coax (HFC)
- Interfaces to SONET STS-1 Networks
- Wireless Local Loop
- PBX interfaces
- E1 Multiplexer
- Digital Access Cross-connect System (DACs)
- E1 Rates PCM Line Interface
- Digital subscriber line access multiplexer (DSLAM)
- E2 Rates PCM Line Interface
