XRT75L03DIV-F Overview
In order to save space on the board, 128-LQFP Exposed Pad packages are used.For packing, Tray is used.Surface Mount is used as telecommunications equipment mounting type.A 3 circuit is the heart of this telecom IC .When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.There is a supply current of 480mA for telecom equipment to operate on.
XRT75L03DIV-F Features
Available in the 128-LQFP Exposed Pad package
XRT75L03DIV-F Applications
There are a lot of MaxLinear, Inc. XRT75L03DIV-F Telecom applications.
- T3 channelized access concentrators
- PCM channel bank
- Channel Banks
- Routers
- T1/E1/J1 add/drop multiplexers (MUX)
- E1 Multiplexer
- Multi-Line E1 Interface Cards
- Microwave transmission systems
- ISDN Primary Rate Interface
- ISDN Primary Rate Interfaces (PRA)
