XRT75L06DIB-F Overview

A 217-BBGA package saves space on a board.The way of Tray is employed for telecommunications equipment packing.In this case, Surface Mount is the mounting type.Telecom circuit is made up of 6 circuits.Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.

XRT75L06DIB-F Features

Available in the 217-BBGA package

XRT75L06DIB-F Applications

There are a lot of MaxLinear, Inc. XRT75L06DIB-F Telecom applications.

• Digital cross connects (DSX-1)
• E1 Network Equipment
• SONET/SDH terminal
• Central office
• Channel Service Units (CSUs): T1/E1/J1
• Multi-Line E1 Interface Cards
• Central office (CO)
• T2 Rates PCM Line Interface
• Multichannel DS1 Test Equipment
• Intelligent PBX