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XRT75L06IB-F

XRT75L06IB-F

XRT75L06IB-F

MaxLinear, Inc.

Telecom device6 Circuits

SOT-23

XRT75L06IB-F Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 217-BBGA
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 6
XRT75L06IB-F Product Details

XRT75L06IB-F Overview


Space is saved on the board by using the 217-BBGA package.Telecommunications equipment is packed using the Tray method.Telecommunications equipment is mounted using Surface Mount.Telecommunications equipment consists of 6 circuits.Wtelecom IC's efficiencyh a high supply voltage, 3.135V~3.465V can be operated more efficiently.The operating temperature set at -40°C~85°C can offer reliable performance.

XRT75L06IB-F Features


Available in the 217-BBGA package

XRT75L06IB-F Applications


There are a lot of MaxLinear, Inc. XRT75L06IB-F Telecom applications.

  • SDH Multiplexers
  • PBXs channel bank
  • Integrated Access Devices
  • PBX interfaces
  • PBX (Private Branch Exchange)
  • Set-Top Box
  • CSU/DSU Equipment
  • E1 Network Equipment
  • Central office
  • ISDN NT1/TA

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