TDA18267HB/C1,557 Overview

In order to save space on the board, the 80-TFQFN Exposed Pad package is used.To pack telecommunications equipment, the way of Tray is used.Telecommunications equipment is mounted with type Surface Mount.16 circuits are used in this telecom IC .

TDA18267HB/C1,557 Features

Available in the 80-TFQFN Exposed Pad package

TDA18267HB/C1,557 Applications

There are a lot of NXP USA Inc. TDA18267HB/C1,557 Telecom applications.

• Switches
• Digital cross connects (DSX-1)
• Multi-Line E1 Interface Cards
• Central office
• Short/Medium Loop
• Digital subscriber line access multiplexer (DSLAM)
• Integrated Multi-Service Access Platforms (IMAPs)
• Fiber to the Home (FTTH)
• E1 Multiplexer
• Central office (CO)