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XRT75R03DIV

XRT75R03DIV

XRT75R03DIV

MaxLinear, Inc.

Telecom device3 Circuits

SOT-23

XRT75R03DIV Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 128-LQFP
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 3
Current - Supply 410mA
XRT75R03DIV Product Details

XRT75R03DIV Overview


A 128-LQFP package is used to reduce board space requirements.Telecommunications equipment is packed according to Tray's method.In this case, Surface Mount is the mounting type.Telecommunications equipment consists of 3 circuits.The voltage supplied to 3.135V~3.465V can improve efficiency.A temperature setting of -40°C~85°C ensures reliable performance.Telecom equipment operates wit h a supply current of 410mA.

XRT75R03DIV Features


Available in the 128-LQFP package

XRT75R03DIV Applications


There are a lot of MaxLinear, Inc. XRT75R03DIV Telecom applications.

  • T1 Digital Cross Connects (DSX-1)
  • T1 Rates PCM Line Interface
  • Channel Banks
  • Private branch exchange (PBX)
  • Channel Service Units (CSUs): T1/E1/J1
  • E1 Multiplexer
  • Digital Cross Connect Systems
  • Home Side Box
  • Short/Medium Loop
  • CSU/DSU E1 Interface

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